Fine Line – High Density Circuitry
PFC has been working on fine line technology for more than 7 years. We understand the materials required, the etching process required, and what it takes to deliver a complex circuit.
Fine line- high density circuitry is becoming more commonplace in the flex circuit marketplace. The use of fine line technology can be found in the telecommunications industry, semiconductor industry, and medical market predominately. PFC considers fine line to be 0.002” lines and space and below. PFC currently provides customers with 0.002” lines and spaces on a daily basis in volume, and has provided flex with ultra fine line geometries as small as 0.0014”.
The benefits of fine line technology, besides providing smaller packaging is condensed I/O. Additional benefits based on new materials include circuit thickness, and circuit flexibility.
PFC recommended design guidelines
Advances in materials and etching technologies have made fine line- high desnity geometries attainable. Standard copper clad-foil for fine line circuitry has 18 microns thick copper and in some cases thinner. Material choices play a big factor in PFC’s ability to provide high density circuits cost effectively.
Micro Vias
High density via fabrication dramatically increases the I/O count. Mechanical drilling of vias is now being done as small as 0.004” (100 micron) diameter. Laser drilling can be done at 0.002” diameter (50 micron) on thin substrates. While PFC offers laser capabilities, the cost to laser each hole one by one becomes expensive.
Call PFC today to discuss your fine line circuit and micro via requirements.
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