IPC-6013 B Qualification and Performance
- specification for flexible printed circuit boards
IPC-2223 Sectional Design
- for flexible printed circuit boards
IPC-4101 Rigid materials
- Materials for rigid and multilayer printed circuit boards
IPC-4203 Cover lays
- Adhesive coated dielectric films for use as cover sheets for flexible wiring and flexible bonding films
IPC-4204 Metal Clad Flexible Dielectrics
- for use in the fabrication of flexible printed wiring boards
IPC-SM-840 Solder mask
- qualification and performance requirements of permanent solder mask
IPC-4552
- Specification for: Electroless Nickel/. Immersion Gold plating (ENIG)
IPC-4554 -
Specification for: Immersion Tin Plating for Printed Circuit Boards |
QQS-571 HASL -
Plating thickness spec Post-process and Output (Hot Air Solder Leveling)
ASTM B 488 -
Standard Specification for Electrodeposited Coatings of Gold
IPC-A-600 -
Acceptability of Printed Circuit Boards
IPC-7711/21 -
Rework, Repair and Modification of Printed Boards
IPC-A-610 -
Acceptability of Electronic Assemblies
J-STD-001 -
Requirements for Soldered Electrical and Electronic assemblies
IPC-HDBK-001 -
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B
IPC-2152 -
Standard for Determining Current-Carrying Capacity in Printed Board Design
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