Materials
| Insulating Materials |
Polymide |
| Clad Materials |
DuPont / Espanex |
| Adhesiveless Materials |
DuPont AP
Espanex |
| Coverfilm |
Kapton (Pyralux)
Espanex |
| Flexible Solder Masks |
IPC-840 Class 3 |
| Metals |
Copper 20-750 micron (.0008 - .030) thick.
Beryllium Copper
Nickel Alloys |
| Finishes |
Immersion gold over Electroless nickel.
Immersion Tin
Hot air solder level (tin-lead)
Hard gold
Soft gold |
Conductors
| Conductors |
Thickness |
(oz/ft2)
|
(microns)
|
Rolled Annealed Copper
|
1/4, 1/3, 1/2, 1, 2, 3
|
9, 12, 17, 35, 70, 105
|
Electrodeposited Copper
|
1/4, 1/2, 1, 2, 3
|
9, 17, 35, 70, 105
|
Silver Epoxy1
|
.001"
|
25
|
Stiffeners
|
Stiffeners
|
Thickness
(mils)
|
Adhesive
|
Adhesive Thickness
|
| (mils) |
(microns) |
| |
|
Polyimide |
0.6, 1.4 |
15, 35 |
| Polyimide |
1,2,3,5 |
FR/LF Acrylic |
1,2,3 |
25, 50, 75 |
| |
|
PSA |
1, 2, 3, 5, 10 |
25, 50, 75, 125, 254 |
|
|
Selective Material Characteristics
- DuPont materials
Thermal Coefficient of Expansion,
ppm/deg°C
(in/in•deg°C) |
TMA |
| Adhesive only (Z-axis) |
|
|
Below TG
(40°C, 104°F) |
100 (10 x 10-5) |
|
| Above TG |
400 (40 x 10-5) |
|
Kapton HN
(X-, Y-, Z-axis) |
20 (2 x 10-5) |
|
|
| Coefficient of Thermal Conductivity, |
|
TC-1000 |
W/m•°K
(cal/cm•sec•°C) |
|
Thermal Comparator |
| Adhesive Only |
0.23 (5.5 x 10-4) |
|
| Kapton® HN |
0.12 (2.87 x 10-4) |
|
|
| Solder Resistance (Dip) |
|
10 min. at 500°F
(260°C) |
No blistering or delamination |
|
5 min. at 550°F
(288°C) |
No blistering or delamination |
IPC 2.4.13 |
30 sec . at 600°F
(316°C) |
No blistering or delamination |
|
Outgassing
|
| Outgassing, Pyralux® LF and AP composites |
Meets Criteria: |
ASTM E 595-77 |
| NASA specification SP-R-0022 |
< 1.0% TML (total mass loss) |
SP-R-0022 |
| |
< 0.10% CVCM (collected volatile condensable material) |
|
|