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Scanning Electron Microscope

Scanning Electron Microscope and X-Ray Microanalysis

PFC has full access to SEM and X-Ray Microanalysis technology. Our partner, SENTEC, is located on PFC’s premises.

The Scanning Electron Microscopy (SEM) and X-Ray Microanalysis (EDS) is a powerful and indispensable tool for failure analysis, troubleshooting and process verification.

The microscopy is ideal for high magnification imaging (well above the magnification limit of light microscopy of 1000-1500x), while EDS microanalysis is used to identify the elemental composition of the material of interest. The technique is particularly useful for identification of inorganic substances.

Use cases	Tests/Analyses Involved
*Process Qualification/Verification*
Pb-free assembly Mixed technology Clean or No-clean process SMT or Wave soldering	Visual and X-ray inspection FTIR Cross-sectioning Light and scanning electron microscopy
*New Vendor/Component Qualification*
Printed Wire Boards Components Material lating integrity Assembly	Visual inspection Thermal stress (solder flow) Cross-sectioning Light and scanning electron microscopy DSC and TGA
*Troubleshooting*
Residue on the assembly Solderability issue Brittle Fracture and Black Pad Opens, shorts, leakage	Visual and X-ray inspection FTIR SEM/EDS Cross-sectioning
*Failure Analysis*
Assembly failures Material related failures Process related failures Handling related failures Environmental failures	Visual inspection and X-ray Inspection Acoustic microscopy Cross-sectioning and parallel lapping Light and scanning electron microscopy FTIR; DSC and TGA